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Sputtering Process Anti-Static Laminated Foam Tape

ESTEE-SP610E\615 series is a kind of foam adhesive tape special for the sputtering process, which is applied to high-temperature vacuum sputtering process to fix IC, BGA, SIP module. This product has good viscosity, excellent anti-static performance and buffer performance, and there is no overflow, no glue residue and the debris are under control after sputtering process.

Keywords:

Classification:

Sputtering Process Tape

Product Details

ESTEE-SP610E\615 series is a kind of foam adhesive tape special for the sputtering process, which is applied to high-temperature vacuum sputtering process to fix IC, BGA, SIP module. This product has good viscosity, excellent anti-static performance and buffer performance, and there is no overflow, no glue residue and the debris are under control after sputtering process.

Feature and Parameter:

Control Item

SP610E

SP615

Structure

PI Tape + foam

Heat separation+ foam tape

Thickness  (um

350~950

Sputtering side peel strength (N/ inch

8~20

10~30

Carrier side peel strength (N/ inch

8~15

Surface resistance  ( Ohms )

106~8

Unwinding voltage(V)@ 300mm/min

<100

Operating temp(℃)

<200

sputter(℃):<120

heat separation temp(℃):>160

Application:

SP610E: assembled double-sided adhesive foam tape, applied to IC/SIP module (big size SIP module, to avoid module bending during high temp process) high temp vacuum sputtering process;
SP615: heat separation assembled double-sided adhesive foam tape, applied to IC/SIP module (big size SIP module, to avoid module bending during high temp process) high temp vacuum sputtering process.

Storage :

Storage conditions: 10-28 ℃, relative humidity 40-70%, avoid direct sunlight, high temperature (above 40°C) or high humidity (above 75%RH).

Storage period: 6 months.

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