Sputtering Process Anti-Static Laminated Foam Tape
ESTEE-SP610E\615 series is a kind of foam adhesive tape special for the sputtering process, which is applied to high-temperature vacuum sputtering process to fix IC, BGA, SIP module. This product has good viscosity, excellent anti-static performance and buffer performance, and there is no overflow, no glue residue and the debris are under control after sputtering process.
Feature and Parameter:
Control Item |
SP610E |
SP615 |
Structure |
PI Tape + foam |
Heat separation+ foam tape |
Thickness (um) |
350~950 |
|
Sputtering side peel strength (N/ inch) |
8~20 |
10~30 |
Carrier side peel strength (N/ inch) |
8~15 |
|
Surface resistance ( Ohms ) |
106~8 |
|
Unwinding voltage(V)@ 300mm/min |
<100 |
|
Operating temp(℃) |
<200 |
sputter(℃):<120 heat separation temp(℃):>160 |
Application:
Storage :
Storage conditions: 10-28 ℃, relative humidity 40-70%, avoid direct sunlight, high temperature (above 40°C) or high humidity (above 75%RH).
Storage period: 6 months.