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Sputtering Process PI Tape
ESTEE-SP609B\610\611\612 series is an PI tape special for the sputtering process, which is applied to high-temperature vacuum sputtering process to fix IC,BGA, SIP module. This product has good viscosity, excellent anti-static performance and there is no overflow, no glue residue and the debris are under control after sputtering process.
|
Control Item |
SP609B |
SP610 |
SP611 |
SP612 |
|
Structure |
PI silicone free tape |
PI double-side tape |
PI single-side tape |
PI/PET single-side tape |
|
Thickness （um） |
50~100 |
200 |
20~50 |
50~200 |
|
Sputtering side peel strength （N/ inch） |
5~8 |
8~12 |
3~5 |
8~20 |
|
Carrier side peel strength （N/ inch） |
/ |
8~12 |
/ |
/ |
|
Surface resistance ( Ohms ) |
106~8 |
N/A |
N/A |
N/A |
|
Unwinding voltage（V）@ 300mm/min |
<100 |
|||
|
Operating temp.（℃） |
<200 |
<220 |
<220 |
<200 |
Application:
Storage :
Storage conditions: 10-28 ℃, relative humidity 40-70%, avoid direct sunlight, high temperature (above 40°C) or high humidity (above 75%RH).
Storage period: 6 months.