Sputtering process antistatic foam tape

ESTEE-SP609\613 series is a kind of foam adhesive tape special for the sputtering process, which is applied to high-temperature vacuum sputtering process to fix IC, BGA, SIP module. This product has good viscosity, excellent anti-static performance and buffer performance, and there is no overflow, no glue residue and the debris are under control after sputtering process.

SP609: assembled double-sided adhesive foam tape, applied to IC/SIP module high temp vacuum sputtering process;

 

SP613: assembled double-sided adhesive foam tape, applied to BGA products (solder ball height between 100~300um) vacuum sputtering process.