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Sputtering process antistatic foam tape

ESTEE-SP609\613 series is a kind of foam adhesive tape special for the sputtering process, which is applied to high-temperature vacuum sputtering process to fix IC, BGA, SIP module. This product has good viscosity, excellent anti-static performance and buffer performance, and there is no overflow, no glue residue and the debris are under control after sputtering process.

Keywords:

Classification:

Anti-static Material for Semiconductor Industry

Product Details

ESTEE-SP609\613 series is a kind of foam adhesive tape special for the sputtering process, which is applied to high-temperature vacuum sputtering process to fix IC, BGA, SIP module. This product has good viscosity, excellent anti-static performance and buffer performance, and there is no overflow, no glue residue and the debris are under control after sputtering process.

 

Feature and Parameter:

Control Item

SP609

SP613

Structure

Foam + PI Tape

Thickness  (um

350~850

Sputtering side peel strength (N/ inch

3~15

Carrier side peel strength (N/ inch

5~8

Surface resistance  ( Ohms )

106~8

Unwinding voltage(V)@ 300mm/min

<100

Operating temp.(℃)

<200

 

Application:

SP609: assembled double-sided adhesive foam tape, applied to IC/SIP module high temp vacuum sputtering process;
 
SP613: assembled double-sided adhesive foam tape, applied to BGA products (solder ball height between 100~300um) vacuum sputtering process.

Storage :

Storage conditions: 10-28 ℃, relative humidity 40-70%, avoid direct sunlight, high temperature (above 40°C) or high humidity (above 75%RH).

Storage period: 6 months.

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