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QFN Package Dedicate Tape

ESTEE-QFN is a kind of QFN (Back Side Film) tape, which used for pasting on the back of semiconductor lead frame and playing a shielding function on the Molding process to prevent the penetration of the molding resin into the shielded area. This product has excellent thermal resistance and anti-static performance.

Affiliate classification：

QFN Tape

Product Description

Product structure:

Feature and Parameter：

Control Item	Technical Parameter
	30PI 50EL	30PI 120EL	35PI 60EL	35PI 80EL	35PI 100EL	35PI 120EL
PI base thickness（um）	25
Adhesive thickness（um）	5		10
Peel strength (gf/inch)	50	120	60	80	100	120
adhesive side surface resistance (ohms)	10^6~8
Unwinding voltage（V）@ 300mm/min	<100
Operating temp.度(°C)	-10～240

Application:

It is applied on the back of the semiconductor lead frame to function as a shield in the molding process and prevent the molding resin from penetrating into the shielded area. It is suitable for surface protection in high temperature where tapes need to be removed without residues.

Storage:

Storage conditions: 10-28 ℃, relative humidity 40-70%, avoid direct sunlight, high temperature (above 40°C) or high humidity (above 75%RH).

Storage period: 6 months.