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QFN Package Dedicate Tape

ESTEE-QFN is a kind of QFN (Back Side Film) tape, which used for pasting on the back of semiconductor lead frame and playing a shielding function on the Molding process to prevent the penetration of the molding resin into the shielded area. This product has excellent thermal resistance and anti-static performance.

Keywords:

Classification:

QFN Tape

Product Details

ESTEE-QFN is a kind of QFN (Back Side Film) tape, which used for pasting on the back of semiconductor lead frame and playing a shielding function on the Molding process to prevent the penetration of the molding resin into the shielded area. This product has excellent thermal resistance and anti-static performance.

 
Product structure:
 
 
Feature and Parameter:

Control Item

  Technical Parameter

30PI 50EL

30PI 120EL

35PI 60EL

35PI 80EL

35PI 100EL

35PI 120EL

PI base thickness(um

25

Adhesive thickness(um

5

10

Peel strength (gf/inch)

50

120

60

80

100

120

adhesive side surface resistance (ohms)

106~8

Unwinding voltage(V)@ 300mm/min

<100

Operating temp.度(°C)

-10~240

 
Application:
It is applied on the back of the semiconductor lead frame to function as a shield in the molding process and prevent the molding resin from penetrating into the shielded area. It is suitable for surface protection in high temperature where tapes need to be removed without residues.
 

Storage:

Storage conditions: 10-28 ℃, relative humidity 40-70%, avoid direct sunlight, high temperature (above 40°C) or high humidity (above 75%RH).
Storage period: 6 months.

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